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Burn In Socket

是应用Rubber的Burn In Test Socket, 以Device No Ball Damage, PCB No Soldering, Hi Speed 体现等优秀特性及结构，提供为顾客定制的最优Solution。

Specifications

DC BI Socket
Normal BI Socket
High Speed BI Socket
Package Type
BGA, LGA etc.
BGA, LGA, QFN etc.
BGA etc.
Available Pitch
0.3P~
0.3P~
0.8P~
Characteristics
- Lifespan varies by test condition
- No Ball Damage
- Lifespan varies by test condition
- No Ball Damage
- Lifespan varies by test condition
- No Ball Damage
- Easy To Repair Board
- Hi Speed Test
Product Series

Customized Solution for your needs

包括美国法人，越南法人，ISC还在海外各国设有代理店， 
并与国外330国家屈指可数的半导体企业建立了Partnership。

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Address : Keumgang Penterium IT Tower 6F, 215 Galmachi-ro, Jungwon-gu, Seongnam-si, Gyeonggi-do, Korea / Tel: +82-31-777-7675 / Fax: +82-31-777-7699 / 원격지원 : 팀뷰어, 코이노


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