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Burn In Socket
是应用Rubber的Burn In Test Socket, 以Device No Ball Damage, PCB No Soldering, Hi Speed 体现等优秀特性及结构，提供为顾客定制的最优Solution。
Specifications
| DC BI Socket | Normal BI Socket | High Speed BI Socket | |
| Package Type | BGA, LGA etc. | BGA, LGA, QFN etc. | BGA etc. |
| Available Pitch | 0.3P~ | 0.3P~ | 0.8P~ |
| Characteristics | - Lifespan varies by test condition - No Ball Damage | - Lifespan varies by test condition - No Ball Damage | - Lifespan varies by test condition - No Ball Damage - Easy To Repair Board - Hi Speed Test |
