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Burn In Socket

是应用Rubber的Burn In Test Socket, 以Device No Ball Damage, PCB No Soldering, Hi Speed 体现等优秀特性及结构,提供为顾客定制的最优Solution。

Specifications

DC BI Socket
Normal BI Socket
High Speed BI Socket
Package Type
BGA, LGA etc.
BGA, LGA, QFN etc.
BGA etc.
Available Pitch
0.3P~
0.3P~
0.8P~
Characteristics
- Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Easy To Repair Board
- Hi Speed Test
Product Series
Customized Solution for your needs

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并与国外330国家屈指可数的半导体企业建立了Partnership。

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