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Probe Head

以High Technology POGO probe及超精密加工Plate的组合，提供最优化的Wafer Probing solution。适用MEMS 工艺的高性能MEMS Probe Head，以Low force, High CCC, 高强度Material的优秀Contact 特性，可提供顾客定制型 solution。

Specifications

POGO Probe Head
MEMS Probe Head
Package Type
Wafer (WLCSP)
Wafer (SOC)
Available Pitch
120um~
80um~
Characteristics
- RF type, Signal length 2.0mm
- Solder Bump
- Wafer Probing & Single Die TEST
- High CCC > 1A
- Copper Pillar (Flat type)
- Wire Bond Pad (Point Type)
Product Series

Customized Solution for your needs

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