Home > Probe Head

Probe Head

以High Technology POGO probe及超精密加工Plate的组合,提供最优化的Wafer Probing solution。适用MEMS 工艺的高性能MEMS Probe Head,以Low force, High CCC, 高强度Material的优秀Contact 特性,可提供顾客定制型 solution。

Specifications

POGO Probe Head
MEMS Probe Head
Package Type
Wafer (WLCSP)
Wafer (SOC)
Available Pitch
120um~
80um~
Characteristics
- RF type, Signal length 2.0mm
- Solder Bump
- Wafer Probing & Single Die TEST
- High CCC > 1A
- Copper Pillar (Flat type)
- Wire Bond Pad (Point Type)
Product Series
Customized Solution for your needs

包括美国法人,越南法人,ISC还在海外各国设有代理店, 
并与国外330国家屈指可数的半导体企业建立了Partnership。

Address : Keumgang Penterium IT Tower 6F, 215 Galmachi-ro, Jungwon-gu, Seongnam-si, Gyeonggi-do, Korea / Tel: +82-31-777-7675 / Fax: +82-31-777-7699 / 원격지원 : 팀뷰어코이노


Copyright © 2019 ISC. All rights reserved.