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以High Technology POGO probe及超精密加工Plate的组合,提供最优化的Wafer Probing solution。适用MEMS 工艺的高性能MEMS Probe Head,以Low force, High CCC, 高强度Material的优秀Contact 特性,可提供顾客定制型 solution。
POGO Probe Head | MEMS Probe Head | |
Package Type | Wafer (WLCSP) | Wafer (SOC) |
Available Pitch | 120um~ | 80um~ |
Characteristics | - RF type, Signal length 2.0mm - Solder Bump - Wafer Probing & Single Die TEST | - High CCC > 1A - Copper Pillar (Flat type) - Wire Bond Pad (Point Type) |