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Test Fixture

使用Rubber, POGO Socket的Mobile, D-TV, Network, Module, etc… ,
可应对各种Package的System Test Solution。

Specifications
Package Type
BGA, LGA, QFN etc
Available Pitch
0.3P~
Characteristics
- Mobile Application Processor
- PMIC, RFIC, Memory IC, NFC,
- Module, SSD, etc.
Product Series
Customized Solution for your needs

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并与国外330国家屈指可数的半导体企业建立了Partnership。

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